Application of Epoxy Accelerator DMP-30_Hubei Bestway New Material Co., Ltd. All Right Reserved.

Epoxy Accelerator DMP-30 can be fast-cured or low-temperature cured epoxy coatings at room temperature for castings, seals, etc. Epoxy Accelerator DMP-30 can be used alone as epoxy resin curing agent. The dosage of bisphenol A epoxy resin with epoxy equivalent of 185-195 is 10%. It can also be mixed with other epoxy curing agents to promote curing. It can improve the curing rate. When used as accelerator, the dosage is 0.1%-3%; when used in epoxy resin-liquid polysulfide system, the dosage is 10%-15% for room temperature curing and 6% for heating curing.

Epoxy Accelerator DMP-30

In general, Epoxy Accelerator DMP-30 alone can impart unique properties to the bonding system and sealing materials. As an accelerator, it can greatly reduce the curing temperature and improve the curing efficiency. It has a wide range of epoxy resin adhesives. use. The ring-opening mechanism of the cured epoxy group is as follows: First, the N atom in Epoxy Accelerator DMP-30 contains lone pair electrons, and the nucleophilicity of the lone pair electron promotes the attack of the epoxy group, and the epoxy group is opened. After that, the formed oxygen anions can further react with epoxy groups, so as to realize the polymerization and curing of epoxy resin.