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Explanation of Epoxy Accelerator DMP-30
Explanation of Epoxy Accelerator DMP-30
Data: 2022-08-16 09:29

Epoxy Accelerator DMP-30 contains phenolic hydroxyl groups in its molecular structure, which increases its activity and can be used for rapid curing. It is mainly used in epoxy resin curing agents and adhesives. In cast and laminated products, this product can be used as a catalyst in the combination of rubber antiozonant and rigid polyurethane foam raw material polyether.

Epoxy Accelerator DMP-30

Epoxy Accelerator DMP-30 is a curing accelerator, also known as K-54, with a molecular weight of 265.4. It can promote the curing of acid anhydrides and amines. It is mainly used in adhesives, electrical insulation, laminates, casting, coatings and other fields.

HUBEI BESTWAY NEW MATERIAL CO., LTD.

 

Tel: 027-85679882

Office Address: Qiming Huijin Building, Hongtu Avenue, Dongxihu District, Wuhan City

Factory Address: Gangsheng Road, Yaojiagang Chemical Park, Zhijiang City, Yichang City, Hubei Province

E-mail: sales@hanepoxy.com

HUBEI BESTWAY NEW MATERIAL CO., LTD.

 

Tel: 027-85679882

Office Address: Qiming Huijin Building, Hongtu Avenue, Dongxihu District, Wuhan City

Factory Address: Gangsheng Road, Yaojiagang Chemical Park, Zhijiang City, Yichang City, Hubei Province

E-mail: sales@hanepoxy.com

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Copyright © 2022 Hubei Bestway New Material Co., Ltd. All Right Reserved.    

鄂ICP备2022003461号           SEO       

 power by : 300.cn