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Epoxy Accelerator DMP-30 contains phenolic hydroxyl groups in its molecular structure, which increases its activity and can be used for rapid curing. It is mainly used in epoxy resin curing agents and adhesives. In cast and laminated products, this product can be used as a catalyst in the combination of rubber antiozonant and rigid polyurethane foam raw material polyether.
Epoxy Accelerator DMP-30 is a curing accelerator, also known as K-54, with a molecular weight of 265.4. It can promote the curing of acid anhydrides and amines. It is mainly used in adhesives, electrical insulation, laminates, casting, coatings and other fields.
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Office Address: Qiming Huijin Building, Hongtu Avenue, Dongxihu District, Wuhan City
Factory Address: Gangsheng Road, Yaojiagang Chemical Park, Zhijiang City, Yichang City, Hubei Province
E-mail： sales@hanepoxy.com
Office Address: Qiming Huijin Building, Hongtu Avenue, Dongxihu District, Wuhan City
Factory Address: Gangsheng Road, Yaojiagang Chemical Park, Zhijiang City, Yichang City, Hubei Province
E-mail： sales@hanepoxy.com
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