The ideal low viscosity epoxy resin will have a better ability to flow, helping with pouring into spaces and pores, and wetting substrates with layers of resin or epoxy down to the smallest details. This adhesion is crucial when encasing fragile electronic circuits, intricate artworks, and in composite fabrication which needs meticulous pouring, sealing, and trimming of surfaces. Its minuscule film like thickness does not weaken any physical, chemical, or adhesive properties during curing making it useful in layered constructions.
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